Nano Fabrication Center
KLA-TENCOR ALPHA-STEP 200
A sturdy reliable profilometer used for measuring film thickness, step height, and surface morphology located inside our Class 100 cleanroom.
Image
Equipment
Contact
UV Cure Station
Hg Lamp with long UV wavelengths ideal for curing epoxy or applications requiring prolonged UV exposure. Protective UV shield and glasses available and required while in the immediate vicinity of the station.
Image
Equipment
Contact
ABM Mask Aligner
Mask aligner used for transferring patterns using either standard UV or Deep UV wavelengths from masks onto substrates. Backside IR alignment capability. Substrates up to 150mm in diameter can be easily accommodated.
Image
Equipment
Contact
KARL SUSS MJB3 Mask Aligner
Used for aligning masks on wafers with photo-resist. Used for 2 and 3 inch wafers.
Image
Equipment
Contact
Blanket Expose System
Used for non-critical image transfer and blanket exposure.
Image
Equipment
Contact
Laurell Spin Coater
A reliable platform used in spin coating primers, photoresists, and polymer coatings located in the lithography area of our Class 100 cleanroom.
Image
Equipment
Contact
AGS Reactive Ion Etcher (RIE) System
Located in our Cleanroom this system is capable of plasma etching and plasma cleaning substrates as large as 300mm (12") in diameter. It can etch silicon nitride, silicon dioxide, polysilicon, germanium and polymers. It can clean and remove photoresists and organic residues.
- Click here to see this instrument/facility cited in publication
- Operating Instructions
- AGS RIE Manuals
- AGS Plasma System 900 Manual
- Alcatel ACP-15G Dry Pump
- AT-6 Automatic Matching Network
- ENI 600W Backup RF Generator
- Oerlikon TW250S Turbo Pump
- Dressler Cesar 136 600W Supply
- Bay Voltex Tempryte Chiller
- MC2 Matching Network Controller
- Pfeiffer Hi Pace 300C Turbo Brochure
- Proteus Industries Flow Switch
Image
Equipment
Contact