A number of different plasma etch/clean systems for a variety of films and treatments. Wet benches and chemicals for a variety of wet etching in both class 10 & class 100 areas. Wafer spin rinse dryers are available. CO2 cleaner available.
High resolution image transfers on substrates up to 6" in diameter. Frontside/backside alignment capability. Low resolution images on substrates up to 12 square inches.
Located in our Class 100 cleanroom, this tool is used to clean substrates and surfaces using an air, oxygen, or argon low intensity plasma, minimizing the need for expensive/toxic solvents while conditioning the surface for maximum wettability or subsequent thin film adhesion. The low intensity plasma is ideal for surface cleaning at near ambient temperatures. Substrates are placed on a tray inside a cylindrical chamber of around 3" in diameter and 7" long. A vacuum is applied to allow for the creation of the low intensity plasma.
